The need to use different plastic materials for surface mount connectors has required manufacturers to make significant capital expenditures. The shrinkage rates and flow characteristics of most plastics used for surface mount are different than those used for through-hole connectors, requiring completely new tooling. In addition to retooling for surface mount interconnects, some manufacturers have tooled through-hole socket and terminal strips, DIP sockets and PGA sockets with high temperature plastics. These interconnects are useful on mixed technology boards which include both surface mount and through-hole components.