For
the highest dual row density applications, connector sets on 1mm x 1mm
grid (FTM and CLM Series) achieve mated profiles of only 3,50mm (.137")
in height. To
replace blade-and-leaf style connectors with a high quality pin-and-socket
system, without changing the PCB layout, staggered 1mm (0.39") pitch
interconnects (BKS and BKT Series) are available.
For
the highest dual row density applications, connector sets on 1mm x 1mm
grid (FTM and CLM Series) achieve mated profiles of only 3,50mm (.137")
in height. 
To
replace blade-and-leaf style connectors with a high quality pin-and-socket
system, without changing the PCB layout, staggered 1mm (0.39") pitch
interconnects (BKS and BKT Series) are available. 
