SMT HANDBOOK - CONTENTS

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Introduction: History and Types of Interconnects
Interconnect Options: .025" (0,64mm) Pitch; 1mm (.039") Pitch; .050" (1,27mm) Pitch; 2mm (.079") Pitch; .100" (2,54mm) Pitch; Surface Mount Sockets
Insulators: Soldering Processes; Plastic Properties; Heat Deflection Temperature versus Processing Temperature; Design Constraints; Mixed Technology
Lead Design: Importance of Solder Joint; Lead Configuration; Lead Pitch; Plating; Tail Design; Alignment Pins; Locking Clips; Standoffs; Pad Design
Contact and Terminal Design: Terminal Materials; Contact Materials; Contact Construction
Solder Joint Reliability: Pull off versus Withdrawal Forces; Test Conditions and Results
Quality Issues: Coplanarity; Skew & Heel to Toe Angle; Process Control
Manufacturability: Pick-and-Place Pads; Packaging