A consistent, high quality solder joint between the connector leads and the printed circuit board is the ultimate objective of any soldering process. However, this interface deserves special consideration with interconnects. There are many conditions that make good solder joints more difficult to accomplish in surface mount applications than with through-hole interconnects. Additionally, interconnect solder joints experience the added stresses of insertion/withdrawal cycles to which non-interconnect components are not subjected. The design and construction of the connector lead has much to do with successful solder joints.