An innovative feature on some interconnects are tails with micro slots in them. The solder penetrates the slot and wets a larger surface area on the lead for higher solder joint strength. It has also been reported that this lead construction can provide a path for organics to escape, reducing the occurrence of voids in the solder, a particular concern with reflow soldering. Also, connectors with slots in their tails tend to adhere to the wet solder paste prior to reflow better than flat leads.