Insulator bodies should be designed to expose the lead/solder pad interface, when possible, for easy cleaning and inspection of the solder joints and to reduce the effects of IR shadowing. (In IR systems not employing convection, components that are shadowed, or not directly exposed to the IR heat source, are heated more slowly than those receiving direct exposure, thus requiring longer soldering times or temperatures.) Socket and terminal strips are usually gull-winged with the leads out and exposed. Hidden leads, a concern with DIP and PLCC sockets where the leads are normally turned in to minimize board space, are exposed with open body designs.