Surface mount technology (SMT) has been practiced since the 1950's, but there has been little use of connectors until recently. This is probably due to the technical challenges that had to be overcome, plus the lack of direct real estate savings with surface mount connectors.

Today, however, interconnects are one of the last remaining through-hole components on many boards. Manufacturing efficiencies can be achieved by eliminating mixed technology boards that use both surface mount and through-hole components, and board populations can be increased by using the bottom side for components or interconnect traces. Additionally, as reflow soldering of through-hole components gained acceptance, micro-centerline interconnect options became more prolific. These micro-centerline connectors were often designed to have a choice of either through-hole or surface mount terminations.