|
Today, however, interconnects are one of the last remaining through-hole
components on many boards. Manufacturing efficiencies can be achieved
by eliminating mixed technology boards that use both surface mount and
through-hole components, and board populations can be increased by using
the bottom side for components or interconnect traces. Additionally, as
reflow soldering of through-hole components gained acceptance, micro-centerline
interconnect options became more prolific. These micro-centerline connectors
were often designed to have a choice of either through-hole or surface
mount terminations.
|