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The need to use different plastic materials
for surface mount connectors has required manufacturers to make significant
capital expenditures. The shrinkage rates and flow characteristics of
most plastics used for surface mount are different than those used for
through-hole connectors, requiring completely new tooling. In addition
to retooling for surface mount interconnects, some
manufacturers have tooled through-hole socket and terminal strips, DIP
sockets and PGA sockets with high temperature plastics. These interconnects
are useful on mixed technology boards which include both surface mount
and through-hole components.
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