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Beyond the factors
under the control of the connector manufacturer, one of the most critical
variables affecting the quality of the solder joint is the design of the
solder pad on the board. Pad layout for specific connector applications
depends on a number of variables:
- lead configuration
- connector pitch
- accuracy and consistency of placement equipment
- tolerance build-up among components
- number, spacing and proximity of traces
- solder paste thickness and alloy
- type of reflow process and number cycles
Because there is such a variety of factors that affect solder joint
quality, it is important to specify and obtain connectors of the highest
quality, designed to meet the stringent needs of surface mount applications,
to avoid needless complications in the board manufacturing process.
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