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A consistent, high quality solder joint between
the connector leads and the printed circuit board is the ultimate objective
of any soldering process. However, this interface deserves special consideration
with interconnects. There are many conditions
that make good solder joints more difficult to accomplish in surface mount
applications than with through-hole interconnects. Additionally, interconnect
solder joints experience the added stresses of insertion/withdrawal cycles
to which non-interconnect components are not subjected. The design and
construction of the connector lead has much to do with successful solder
joints.
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